Product Description
6J13 Manganin Alloy Foil (0.0125mm Thickness × 100mm Width)
Product Overview
6J13 manganin alloy foil (0.0125mm×100mm), a ultra-thin precision resistance material independently developed by Huona New Material, is a Mn-Cu-Ni ternary alloy foil engineered for miniaturized high-precision components. Through proprietary "ultra-thin cold-rolling + vacuum annealing" technology, this foil achieves an extreme thickness of 0.0125mm (12.5μm) with ultra-tight tolerance (±0.0005mm) and uniform width of 100mm—perfectly matching the processing requirements of micro-electronic elements and pressure sensor grids. It integrates ultra-low resistance temperature coefficient (TCR), excellent flexibility, and superior micro-etchability—becoming the core material for ultra-miniature resistors, strain gauge grids in pressure sensors, and thin-film resistance elements in high-density electronic devices.
Standard Designations & Application-Oriented Foundation
- Dimensional Specification: 0.0125mm (12.5μm) thickness × 100mm width (tolerance: thickness ±0.0005mm, width ±0.15mm)
- International Alignment: Performance comparable to DIN 17471 CuMn12Ni2 ultra-thin foils, with adjusted Ni-Mn ratio to prevent brittle fracture during ultra-thin rolling
- Compliant Standards: GB/T 1234-2019 (resistance alloy strips/foils) + GB/T 2059-2021 (copper alloy foils) + IEC 60404-8-2 (precision resistance components for sensors)
- Manufacturer: Huona New Material, certified to ISO 9001 and RoHS, with specialized ultra-thin foil production lines (minimum rolling thickness 0.005mm)
Key Core Advantages (Tailored for 0.0125×100mm & Sensor/Electronic Applications)
1. Ultra-Thin Precision for Miniaturization
- Extreme Thickness Advantage: 0.0125mm thickness (12.5μm) is 75% thinner than conventional 0.05mm manganin strips, enabling component volume reduction by 60%—critical for ultra-slim electronic devices (e.g., foldable phone sensors) and micro-pressure transducers (where space between sensing layers is ≤20μm).
- Dimensional Uniformity: Thickness variation across the entire foil width (100mm) is ≤0.0003mm, ensuring resistance consistency ±0.03% for micro-resistors—avoiding signal drift in pressure sensors caused by uneven thickness.
2. Sensor-Specific Performance Optimization
- Stable TCR for Measurement Accuracy: TCR as low as ±8 ppm/℃ (-40℃ to 140℃), perfectly matching the operating temperature range of industrial pressure sensors (-20℃ to 120℃). Resistance drift <0.006% after 2000 hours of continuous operation at 80℃—ensuring pressure measurement error ≤0.1% FS (full scale).
- Flexibility for Curved Sensors: Elongation ≥28% (annealed state) enables bending to a minimum radius of 0.1mm (8× thickness) without cracking—ideal for curved pressure sensor diaphragms (e.g., automotive tire pressure sensors) and flexible electronic components.
3. Micro-Processing Adaptability for Electronic Elements
- Ultra-Fine Etchability: Uniform microstructure (grain size ≤15μm) and bright annealed surface (Ra ≤0.1μm) support micro-chemical etching with line width as narrow as 0.01mm—meeting the production of high-density resistor arrays in integrated circuits and strain gauge grids in precision pressure sensors.
- Clean Surface for Thin-Film Bonding: Oil-free, oxide-free surface (verified via XPS analysis) ensures strong adhesion with polyimide (PI) and epoxy substrates (peel strength ≥0.8 N/mm)—critical for sensor foil-substrate bonding without delamination.
Technical Specifications (With Application-Specific Data)
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Attribute
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Value (Typical)
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Application Significance
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Chemical Composition (wt%)
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Cu: 82.0-86.0%; Mn: 12.0-13.0%; Ni: 2.0-3.0%; Fe: ≤0.5%; Si: ≤0.1%
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Optimized for ultra-thin rolling ductility (avoids fracture)
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Thickness
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0.0125mm (12.5μm) (tolerance: ±0.0005mm)
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Fits micro-sensor layer gaps (≤20μm)
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Width
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100mm (tolerance: ±0.15mm)
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Matches standard sensor substrate sizes (100mm×100mm)
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Resistivity (20℃)
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0.44±0.04 μΩ·m
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Balanced for 0.01mm line-width resistors (avoids overheating)
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TCR (-40℃ to 140℃)
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±8 ppm/℃
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Ensures pressure sensor accuracy ≤0.1% FS
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Elongation (Annealed)
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≥28%
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Enables curved sensor diaphragm applications
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Surface Roughness (Ra)
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≤0.1μm
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Supports ultra-fine etching (0.01mm line width)
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Peel Strength (vs PI Substrate)
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≥0.8 N/mm
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Prevents delamination in sensor assemblies
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Operating Temperature Range
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-50℃ to 130℃ (continuous)
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Covers electronic 元件 (-10℃ to 60℃) and industrial sensors (-20℃ to 120℃)
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Product Specifications (With Processing Support)
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Item
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Specification
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Processing Advantage
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Surface Finish
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Bright annealed (oxide-free, oil-free)
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Reduces etching pre-treatment time by 30%
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Flatness
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≤0.03mm/m
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Ensures uniform etching and bonding pressure
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Supply Form
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Rolls (20m/50m per spool, spool diameter 80mm)
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Prevents foil creasing (critical for ultra-thin materials)
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Cutting Precision
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Cut-to-length (minimum 50mm, tolerance ±0.1mm)
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Suitable for small-batch sensor prototype production
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Custom Add-Ons
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Anti-tarnish passivation (18-month anti-oxidation); substrate bonding pre-treatment
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Extends shelf life and simplifies sensor assembly
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Typical Application Scenarios (Targeted & Detailed)
- Pressure Sensors: Strain gauge grids for MEMS pressure transducers (0.0125mm thickness fits diaphragm layers, low TCR ensures measurement accuracy ±0.1% FS) and industrial pressure sensors (flexibility adapts to curved diaphragms in pipeline pressure monitoring).
- Ultra-Miniature Electronic Elements: Thin-film resistors for foldable smartphones (ultra-thin thickness reduces device thickness by 0.3mm) and high-density resistor arrays for IoT micro-controllers (100mm width supports batch production of 100+ resistor grids per foil sheet).
- Precision Measuring Instruments: Resistance elements for portable digital pressure gauges (stable TCR minimizes temperature-induced errors) and micro-current shunts for low-power electronic sensors (0.0125mm thickness enables current sensing down to 0.1A with ±0.05% accuracy).
- Automotive Electronics: Strain gauge foils for tire pressure monitoring systems (TPMS) (flexibility fits curved tire inner surfaces) and micro-resistors for in-car sensor modules (ultra-miniature size adapts to compact electronic compartments).
Huona's Application-Specific Support
- Sensor Etching Kit: Provides free etching parameter templates (etchant concentration, temperature, time) for 0.0125mm foil—optimized for 0.01-0.03mm line-width strain gauge grids, reducing customer process debugging time by 60%.
- Substrate Bonding Guidance: Offers tailored recommendations for adhesive selection (epoxy/PI) and bonding parameters (temperature, pressure) to ensure peel strength ≥0.8 N/mm—avoiding delamination issues in sensor use.
- Small-Batch Customization: Accepts MOQ of 20m for this fixed 规格,supporting R&D teams in pressure sensor prototype development and small-batch production of high-precision electronic elements.
Huona New Material implements "ultra-thin precision quality control" for 6J13 manganin alloy foil (0.0125×100mm): each roll undergoes laser thickness measurement (200 sampling points/m), atomic force microscopy (AFM) surface roughness inspection, and TCR testing in temperature-controlled chambers (accuracy ±0.1 ppm/℃). Free samples (100mm×100mm) and micro-etching test reports are available upon request—helping customers quickly validate the foil's suitability for pressure sensor and electronic element production.
